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Products

HYG812A01018A

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HYG812A01018A
Production process

Specification
Code HYG812A01018A Customer PN


Layer 1 Blind/Buried Via NO

Base Material Alu
Unit Size(mm) 45.0000
X 45.0000
Board thickness 1.6mm Panle Size(mm) 225.0000 X 180.0000
Min hole 3.2mm Pcs/Panle 1 X 2
Total Holes 80 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) /
Min Hole Copper Thickness 20um

Outline Finish CNC+V-CUT
Finish thickness tolerance +/-10%

Contour tolerance +/-0.15mm Surface Finishing
HASL Lead Free


X-out 3X Solder Mask White

Special request
Resistance welding ink pm-500wd 16sf, ink thickness not less than 10um
Silkscreen Black

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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